silicon wafer signed by Gordon Moore, 2005
- Made:
- 2005 in United States
This image is released under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 Licence
This image is released under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 Licence
This image is released under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 Licence
This image is released under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 Licence
This image is released under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 Licence
This image is released under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 Licence
Science Museum Group Collection
© The Board of Trustees of the Science Museum
Science Museum Group Collection
© The Board of Trustees of the Science Museum
Science Museum Group Collection
© The Board of Trustees of the Science Museum
Science Museum Group Collection
© The Board of Trustees of the Science Museum
Science Museum Group Collection
© The Board of Trustees of the Science Museum
Science Museum Group Collection
© The Board of Trustees of the Science Museum
Silicon wafer signed by Gordon Moore for the 40th anniversary of Moore’s Law, with Pentium 4 processors, made by the Intel Corporation, United States, 2005. Complete with case.
Silicon wafer signed by Gordon Moore for the 40th anniversary of Moore’s Law, with Pentium 4 processors, made by the Intel Corporation, United States, 2005.
This silicon chip is covered with Intel Pentium 4 microprocessors, and is signed by Gordon E Moore (b. 1929), one of the co-founders of microchip producer Intel. In an article published in 1965 Moore made a prediction that “the number of transistors incorporated in a chip will approximately double every 24 months." His prediction was broadly correct for the following 40 years, and this wafer was signed by Moore to mark the 40th anniversary of what had come to be known as Moore’s Law.
On display
Science Museum: Information Age Gallery: Cell
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Details
- Category:
- Computing & Data Processing
- Object Number:
- 2005-78
- Materials:
- plastic (unidentified) and silicon
- type:
- silicon wafer
- taxonomy:
-
- furnishing and equipment
- tools & equipment
- credit:
- Donated by Intel Corporation
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