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Silicon wafer signed by Gordon Moore, 2005

Silicon wafer signed by Gordon Moore, 2005

2005
Thermally oxidised silicon wafer

Thermally oxidised silicon wafer

1996
Thermally oxidised silicon wafer

Thermally oxidised silicon wafer

1996
I C chips

I C chips

1996
Silicon wafer patterned with aluminium

Silicon wafer patterned with aluminium

1996
Silicon wafer patterned with aluminium

Silicon wafer patterned with aluminium

1996
Silicon Wafer

Silicon Wafer

Silicon wafer - Low pressure CVD (chemical vapour deposition) oxide

Silicon wafer - Low pressure CVD (chemical vapour deposition) oxide

1996
Silicon wafer signed by Gordon Moore for the 40th anniversary of Moore’s Law, with Pentium 4 processors, 2005. Complete with case.

silicon wafer signed by Gordon Moore, 2005

2005
Plain silicon wafer

Plain silicon wafer

1996
Aluminium deposit (K1342U/4)

Aluminium deposit

1996
Cardboard sleeve containing circular silver silicon wafer. Wafer is protected by bubble wrap and cardboard container. Card sleeve labelled 'Accodata 5 1/4" diskette mailer. Code No.50475. Made in Gt. Britain'. Handwritten note on sleeve reads 'Silicon wafer'

Silicon wafer

1968-1987
Oxidised wafer (K1342U/1)

Oxidised wafer (K1342U/1)

1996
Oxide with patterned photoresist (K1342U/2)

Oxide with patterned photoresist (K1342U/2)

1996
After second etch to remove aluminium (K1342U/6)

Silicon wafer after second etch to remove aluminium (K1342U/6)

1996
After oxide etch: oxide removed, revealing silicon underneath (K1342U/3)

After oxide etch: oxide removed

1996
Second pattern in photoresist (K1342U/5)

Second pattern in photoresist

1996